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Business Philosophy "Quarter-Lead"
TOWA is the world's No.1 manufacturer of semiconductor molding equipment and molds, which are used in semiconductor manufacturing to protect semiconductor chips mainly with resin.
We, as a top tier ultra-precision mold company with core technology, have accomplished various technology innovations in molding process, such as multi-plunger system and compression system, and singulation process -back end molding process. Also, we have developed automation system related to these technologies.
Expanding technologies such as AI (Artificial Intelligence),EV(Electric Vehicle) and automatic driving system are all realized by semiconductors. Big growth in these business fields is expected to continue.
For many years we have led molding and singulation process in semiconductor packaging field. This success is wholly based on seeking what our customers really need thoroughly, putting our business philosophy "Strive to develop key technologies and maintain 'quarter-lead' over the competition in order to ensure that our innovative products are always the first to market" into practice and creating new market.
Our original compression technology is the molding method with no resin flow and best for leading-edge semiconductor packaging ― the technology required for the packaging has become more and more difficult as layering and modularization in semiconductor memory and semiconductor for generative AI goes on.
And the compression method makes the efficiency in the use of resin almost 100%. The compression method contributes greatly to customer’s cost reduction and reduces the amount of waste, which makes it a more environmentally friendly molding technology. The compression technology is unrivaled from its release in 2009.