Molding technologies are used to seal semiconductors by electrically insulating them from the outside using resin. These technologies are essential to ensure the reliability of semiconductors.
At TOWA, we develop dicers and handlers, the main functions of singulation equipment.
As the leading company in resin sealing technologies for semiconductors and other electronic components, we at TOWA Corporation have supplied a number of ultra-precision molds to the market. These products have been highly acclaimed by customers.
Developed by utilizing technologies cultivated through the manufacture of ultra-precision molds, End mills and Drills from TOWA boast high precision, superior abrasion resistance, and a long life-span.
Supporting TSS with IoT technologies TEN-System
TEN-System supports TSS comprehensively with IoT and a web system, allowing us to provide appropriate services promptly.
In addition to trading in the global market, we consistently engage in purchase, reclamation, sales, and provision of support, all essential for trading used equipment.
General Meeting of Shareholders
The 46th Ordinary General Meeting of Shareholders
Date and Time
June 27, 2024 (Thursday) 10:00 a.m.
Venue
5, Kamichoshi-cho, Kamitoba, Minami-ku, Kyoto, Japan
Meeting room on the seventh floor of the Company’s HQ building
Convocation Notice(Newest)
Convocation Notice
From Kyoto to the World
5 Kamichoshi-cho, Kamitoba, Minami-ku, Kyoto-shi, Kyoto
601-8105 JAPAN
TEL (＋81)75-692-0250(main)
FAX (＋81)75-692-0270
Certified to ISO 9001:
the international standard for quality assurance.
(Excluding Bandoh Memorial Research Laboratory
and INNOMS Promotion Dept.)
©1999-2024 TOWA JAPAN ALL Rights Reserved.
