FFT-Series
FFT1030G
Compression Molding Equipment
Features
- TOWA's proprietary compression molding method using granular resin
- Full automatic equipment suitable for multi-product variable production
- Corresponding to the wafer level molding (manual system)
- Environmentally friendly equipment that generates no waste
Compression Molding Equipment
Features
- TOWA's proprietary compression molding method that using liquid resins (silicone/epoxy)
- Suitable for multi-product variable production such as LED package
- Full automatic equipment capable of automatic substrate loading and automatic resin supply by dispenser unit
- Corresponding to the wafer level molding (manual system)
- Environmentally friendly equipment that generates no waste
- For inquiries about products, click here.
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From Kyoto to the World
