All-in-one transfer molding system for high quality molding
Features
- Applicable for large lead frames 100×300 mm.
- By utilizing our high-rigidity press structure (hold frame), we are able to achieve an uniform clamping surface pressure, an optimal path line and a compact footprint.
- Release film compatible (side gate systems).
- Side gate/top gate applicable.
- Modular press supporting different production quantities.
- For inquiries about products, click here.
YPM1200
High productivity transfer molding system for lead frames
Features
- 200 ton high-output press for larger sizes.
- Dual plunger and long tablet specifications are available for large resin volumes.
- Equipped with a plunger dust collection mechanism for stable production.
- Standardization of options that are frequently needed in Lead Frame production.
- Modular concept to adapt to different production quantities.
Transfer molding system for automotive and power packages
Features
- Supports a wide range of automotive products (e.g. power modules, ECUs and sensors).
- Independent upper and lower pin mechanism enables high-precision molding customized for the product.
- Separated upper/lower drive sources enables higher AC servo precision control.
- Modular concept to adapt to different production quantities.
Transfer molding system utilizing high fluidity resin realizing high quality molds for substrates
Features
- Simplified chase structure enables cost reduction and easy package type conversion.
- Applicable for MUF molding.
- Edge gate method prevents resin leakage when molding with high fluid resin.
- Modular concept to adapt to different production quantities.
Transfer molding system applicable for exposed die molding and varying package thickness
Features
- Original mold driving system enables exposed die moiding and variable package thickness.
- Applicable for various product types in 1 system by the mechanism for variable package thickness and substrate thickness.
- Introduce the mechanism suitable for MUF molding.
- Modular concept to adapt to different production quantities.
Transfer molding system for 2.5D/3DIC/Chiplet products
Features
- Large press capable of handling individual substrate sizes up to 150 mm (6 inches)
- Compatible with boat carriers for individual substrate handling
- Edge gate design prevents resin leakage such as side rail flashing
- Cotters automatically adjusted for each substrate to accommodate
- Large flow cavity and R.F.C.P. enable MUF molding of large chips, which are difficult to fill.
- Double plunger supports necessary resin amount for large-area
- Modular concept to adapt to different production quantities
- For inquiries about products, click here.
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From Kyoto to the World
