The FMS Series is a fully automatic singulation system that is capable of handling substrates ranging from 40mm X 150mm to 100mm X 300mm in size, which are used for semiconductor production in many cases.

TOWA original dicer unit makes it possible to cut semiconductors into pieces as small as 1.0mm X 1.0mm.

Dicer units from TOWA use twin-cut tables and twin spindles. In addition, our handler units come with a variable pitch mechanism for the pick and place unit. This ensures high-speed conveyance and stable storage, enabling UPH40,000.

Further, our singulation systems maintain optimal cutting precision by correcting highly warped molded products before cutting them and checking for the misalignment of products -- which may be caused by their expansion, contraction, or deformation -- with a camera while they are being cut, and correcting them. They also come with a built-in function for visual inspection of products, allowing customers to reduce the number of inspection processes.

The LGR series is a laser grooving system dedicated to wettable QFN packages.
It supports workpiece sizes up to 100 mm × 300 mm.
Laser grooving only removes the resin on top of the leadframe, ensuring stable terminal side steps.

The FWC1020 is a fully automated system for correcting product warpages that occurs in the semiconductor manufacturing process.
It corrects product warpages with temperature-controlled heating and cooling units for samples with a maximum size of 300 mm (L) x 100 mm (W).
Handling errors and product defects can be reduced and productivity can be improved by correcting sample warpages.
Additionally, a cooling water circulation system is used as an environmentally friendly solution.